Disclaimer: Always refer to the manufacturer's official data sheet for the exact UFS 3.1 chip model you are using, as pin assignments can vary slightly between different 153-ball devices.
Differential output signals from host view (DIN for device). Receive Pairs
UFS 3.1 utilizes a differential serial interface (M-PHY) with up to two lanes for data transfer. Mouser Electronics Data Lanes (Differential Pairs): DIN_t / DIN_c: Input data lanes (Host to Device). DOUT_t / DOUT_c: Output data lanes (Device to Host). Power Supplies: VCC (2.7V – 3.6V): Main power for the NAND flash media. VCCQ (1.14V – 1.26V): Power for the UFS controller and I/O interface. VCCQ2 (1.7V – 1.95V):
It is important to note that there is no single "universal" pinout diagram for the physical BGA (Ball Grid Array) package. JEDEC defines the interface signals, but the physical ball assignment is determined by the package size and density.
Note: Always consult the specific datasheet for your device (e.g., Kioxia, Samsung) as minor layout variations may occur. 2.1 Signal Groups ufs 3.1 pinout
: Many central balls (e.g., row F–J) are NC (No Connect) . Do not ground them – they may be test points or unused.
: A 153-ball package commonly used for high-capacity mobile storage.
While specific vendor datasheets (Samsung, SK Hynix, Micron) should always be cross-referenced for exact coordinate variations, standard JEDEC UFS implementations cluster the high-speed signals toward the center or a distinct quadrant to protect them from edge noise. Signal Name Connection Type Description Input (From SoC) Primary Receive Data Differential Pair (Lane 0) DIN_B_P / DIN_B_N Input (From SoC) Secondary Receive Data Differential Pair (Lane 1) DOUT_A_P / DOUT_A_N Output (To SoC) Primary Transmit Data Differential Pair (Lane 0) DOUT_B_P / DOUT_B_N Output (To SoC) Secondary Transmit Data Differential Pair (Lane 1) REF_CLK Reference Clock Signal from Host RST_N Hardware Global Reset Line VCC Core NAND Flash Voltage Supply (2.97V - 3.3V) VCCQ Controller Logic Voltage Supply (1.2V) VCCQ2 MIPI M-PHY Analog Interface Supply (1.8V) VSS Common Ground Reference Rail Practical Engineering & Forensic Challenges
Hardware Reset. An active-low signal used by the host processor to reset the storage device. D. Ground (GND) Disclaimer: Always refer to the manufacturer's official data
Lane 1 Transmit Data (Complement) [Dual-lane configurations] System Ground / Shielding Blocks 5. Practical Engineering Applications Hardware Prototyping & Oscilloscope Testing
UFS 3.1 utilizes a full-duplex serial interface with MIPI M-PHY physical layer and UniPro link layer protocols. This architecture allows simultaneous reading and writing, drastically increasing throughput. The physical manifestation of this advanced architecture is a grid of solder balls (BGA) underneath the chip. UFS 3.1 Physical Package (BGA)
A UFS socket aligns the 153 balls on the chip with the programmer, allowing for data recovery or firmware flashing. 6. Summary
#ElectricalEngineering #TechTips #UFS31 #MobileRepair Mouser Electronics Data Lanes (Differential Pairs): DIN_t /
Understanding the —specifically the JEDEC-standard 153-ball BGA (Ball Grid Array) package—is crucial for hardware designers, engineers, and technicians involved in smartphone repair or storage device development. 1. What is UFS 3.1 and Why Pinout Matters
If you are designing a PCB with UFS 3.1, I can provide more details on routing guidelines or help you identify specific power requirements based on a particular manufacturer's data sheet. Datasheet - Arasan Chip Systems
Uses a parallel bus architecture consisting of an 8-bit data bus, a command line, and a clock signal. It operates in half-duplex mode, meaning the system cannot read and write data simultaneously.
If you're looking at a UFS 3.1 BGA footprint, here is the critical pinout logic you need to know:
(NC = No Connect / Reserved)
